o: ActiveSupport::Cache::Entry :@compressedF: @value""
Modules/CommRF/BLE01A/SCH_PCB/BLE01A.sch
39 39 
encoding utf-8
40 40 
Sheet 1 1
41 41 
Title "BLE01"
42 
Date "09. 12. 2014"
42 
Date "18. 1. 2015"
43 43 
Rev "A"
44 44 
Comp "Mlab www.mlab.cz"
45 45 
Comment1 "Module with the NRF8001 Bluetooth Low Energy chip from Nordic Semiconductor"
......
70 70 
	1    0    0    -1
71 71 
$EndComp
72 72 
$Comp
73 
L HEADER_2x03_PARALLEL J1
73 
L HEADER_2x03_PARALLEL J2
74 74 
U 1 1 5463A76E
75 75 
P 2350 6550
76 
F 0 "J1" H 2350 6350 60  0000 C CNN
76 
F 0 "J2" H 2350 6350 60  0000 C CNN
77 77 
F 1 "1.9V ... 3.6V" H 2350 6750 60  0000 C CNN
78 78 
F 2 "Pin_Header_Rect_Pads:Straight_2x03" H 2350 6650 60  0001 C CNN
79 79 
F 3 "" H 2350 6650 60  0000 C CNN
......
92 92 
	1    0    0    -1
93 93 
$EndComp
94 94 
$Comp
95 
L CP2 C2
95 
L CP2 C12
96 96 
U 1 1 5463A888
97 97 
P 1400 6800
98 
F 0 "C2" H 1400 6900 40  0000 L CNN
98 
F 0 "C12" H 1400 6900 40  0000 L CNN
99 99 
F 1 "22uF/6.3V" H 1400 6700 40  0000 L BNN
100 100 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 1438 6650 30  0001 C CNN
101 101 
F 3 "" H 1400 6800 60  0000 C CNN
......
103 103 
	1    0    0    -1
104 104 
$EndComp
105 105 
$Comp
106 
L DIODE D1
106 
L DIODE D2
107 107 
U 1 1 5463A8AD
108 108 
P 1800 6800
109 
F 0 "D1" V 1900 6850 40  0000 C CNN
109 
F 0 "D2" V 1900 6850 40  0000 C CNN
110 110 
F 1 "1N4007" V 1700 6800 40  0000 R TNN
111 111 
F 2 "SMD_Packages:SMD-0805" H 1800 6800 60  0001 C CNN
112 112 
F 3 "" H 1800 6800 60  0000 C CNN
......
131 131 
Wire Wire Line
132 132 
	1000 6550 2100 6550
133 133 
$Comp
134 
L C C1
134 
L C C11
135 135 
U 1 1 5463C409
136 136 
P 1000 6800
137 
F 0 "C1" H 1000 6900 40  0000 L CNN
137 
F 0 "C11" H 1000 6900 40  0000 L CNN
138 138 
F 1 "100nF" H 1000 6700 40  0000 L BNN
139 139 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 1038 6650 30  0001 C CNN
140 140 
F 3 "" H 1000 6800 60  0000 C CNN
......
159 159 
	1    0    0    -1
160 160 
$EndComp
161 161 
$Comp
162 
L C C6
162 
L C C5
163 163 
U 1 1 5463CABB
164 164 
P 7550 3300
165 
F 0 "C6" H 7600 3400 40  0000 L CNN
165 
F 0 "C5" H 7600 3400 40  0000 L CNN
166 166 
F 1 "12pF" H 7600 3200 40  0000 L CNN
167 167 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 7588 3150 30  0001 C CNN
168 168 
F 3 "" H 7550 3300 60  0000 C CNN
......
170 170 
	1    0    0    -1
171 171 
$EndComp
172 172 
$Comp
173 
L C C5
173 
L C C4
174 174 
U 1 1 5463CB53
175 175 
P 6850 3300
176 
F 0 "C5" H 6900 3400 40  0000 L CNN
176 
F 0 "C4" H 6900 3400 40  0000 L CNN
177 177 
F 1 "12pF" H 6900 3200 40  0000 L CNN
178 178 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 6888 3150 30  0001 C CNN
179 179 
F 3 "" H 6850 3300 60  0000 C CNN
......
229 229 
	1    0    0    -1
230 230 
$EndComp
231 231 
$Comp
232 
L C C10
232 
L C C8
233 233 
U 1 1 5463D5AF
234 234 
P 9650 4650
235 
F 0 "C10" V 9800 4650 40  0000 L CNN
235 
F 0 "C8" V 9800 4650 40  0000 L CNN
236 236 
F 1 "1.8pF" V 9500 4600 40  0000 L CNN
237 237 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 9688 4500 30  0001 C CNN
238 238 
F 3 "" H 9650 4650 60  0000 C CNN
......
240 240 
	0    -1   -1   0
241 241 
$EndComp
242 242 
$Comp
243 
L C C12
243 
L C C10
244 244 
U 1 1 5463D807
245 245 
P 9450 5650
246 
F 0 "C12" H 9450 5750 40  0000 L CNN
246 
F 0 "C10" H 9450 5750 40  0000 L CNN
247 247 
F 1 "2.2nF" H 9456 5565 40  0000 L CNN
248 248 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 9488 5500 30  0001 C CNN
249 249 
F 3 "" H 9450 5650 60  0000 C CNN
......
304 304 
Wire Wire Line
305 305 
	10200 4850 10200 4900
306 306 
$Comp
307 
L C C11
307 
L C C9
308 308 
U 1 1 5463E415
309 309 
P 9900 4900
310 
F 0 "C11" H 9900 5000 40  0000 L CNN
310 
F 0 "C9" H 9900 5000 40  0000 L CNN
311 311 
F 1 "1.2pF" H 9906 4815 40  0000 L CNN
312 312 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 9938 4750 30  0001 C CNN
313 313 
F 3 "" H 9900 4900 60  0000 C CNN
......
473 473 
	1    0    0    -1
474 474 
$EndComp
475 475 
$Comp
476 
L C C3
476 
L C C2
477 477 
U 1 1 5463CB28
478 478 
P 5700 3300
479 
F 0 "C3" H 5750 3400 40  0000 L CNN
479 
F 0 "C2" H 5750 3400 40  0000 L CNN
480 480 
F 1 "1nF" H 5750 3200 40  0000 L CNN
481 481 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 5738 3150 30  0001 C CNN
482 482 
F 3 "" H 5700 3300 60  0000 C CNN
......
484 484 
	1    0    0    -1
485 485 
$EndComp
486 486 
$Comp
487 
L C C4
487 
L C C3
488 488 
U 1 1 5463CD08
489 489 
P 5950 3300
490 
F 0 "C4" H 6000 3400 40  0000 L CNN
490 
F 0 "C3" H 6000 3400 40  0000 L CNN
491 491 
F 1 "1uF" H 6000 3200 40  0000 L CNN
492 492 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 5988 3150 30  0001 C CNN
493 493 
F 3 "" H 5950 3300 60  0000 C CNN
......
538 538 
	3500 2700 3500 2650
539 539 
Connection ~ 3500 2650
540 540 
$Comp
541 
L C C8
541 
L C C7
542 542 
U 1 1 5463DF60
543 543 
P 1750 3350
544 
F 0 "C8" H 1800 3450 40  0000 L CNN
544 
F 0 "C7" H 1800 3450 40  0000 L CNN
545 545 
F 1 "33nF" H 1800 3250 40  0000 L CNN
546 546 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 1788 3200 30  0001 C CNN
547 547 
F 3 "" H 1750 3350 60  0000 C CNN
......
549 549 
	1    0    0    -1
550 550 
$EndComp
551 551 
$Comp
552 
L C C7
552 
L C C6
553 553 
U 1 1 5463E21E
554 554 
P 1500 3350
555 
F 0 "C7" H 1550 3450 40  0000 L CNN
555 
F 0 "C6" H 1550 3450 40  0000 L CNN
556 556 
F 1 "100nF" H 1550 3250 40  0000 L CNN
557 557 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 1538 3200 30  0001 C CNN
558 558 
F 3 "" H 1500 3350 60  0000 C CNN
......
616 616 
Wire Wire Line
617 617 
	7200 4450 6850 4450
618 618 
Wire Wire Line
619 
	7200 4550 6850 4550
620 
Wire Wire Line
621 
	7200 4650 6850 4650
622 
Wire Wire Line
623 619 
	7200 4750 6850 4750
624 620 
Wire Wire Line
625 621 
	7200 4850 6850 4850
626 622 
Wire Wire Line
627 623 
	7200 4950 6850 4950
624 
Wire Wire Line
625 
	7200 5050 6850 5050
626 
Wire Wire Line
627 
	7200 5150 6850 5150
628 628 
Text Label 6850 4450 0    60   ~ 0
629 629 
ACTIVE
630 
Text Label 6850 4550 0    60   ~ 0
630 
Text Label 6850 4750 0    60   ~ 0
631 631 
SCK
632 
Text Label 6850 4750 0    60   ~ 0
632 
Text Label 6850 4950 0    60   ~ 0
633 633 
MOSI
634 
Text Label 6850 5050 0    60   ~ 0
635 
MISO
634 636 
Text Label 6850 4850 0    60   ~ 0
635 
MISO
636 
Text Label 6850 4650 0    60   ~ 0
637 637 
REQN
638 
Text Label 6850 4950 0    60   ~ 0
638 
Text Label 6850 5150 0    60   ~ 0
639 639 
RDYN
640 640 
Wire Wire Line
641 
	7200 5050 6850 5050
641 
	7200 4550 6850 4550
642 642 
Wire Wire Line
643 
	7200 5150 6850 5150
643 
	7200 4650 6850 4650
644 644 
Wire Wire Line
645 645 
	7200 5250 6850 5250
646 
Text Label 6850 5050 0    60   ~ 0
646 
Text Label 6850 4550 0    60   ~ 0
647 647 
TXD
648 
Text Label 6850 5150 0    60   ~ 0
648 
Text Label 6850 4650 0    60   ~ 0
649 649 
RXD
650 650 
Text Label 6850 5250 0    60   ~ 0
651 651 
RESET
......
670 670 
Text Notes 1550 6150 0    60   ~ 0
671 671 
POWER INPUT
672 672 
$Comp
673 
L HEADER_2x09_PARALLEL J2
673 
L HEADER_2x09_PARALLEL J1
674 674 
U 1 1 547FBDAB
675 675 
P 7450 4850
676 
F 0 "J2" H 7450 4350 60  0000 C CNN
676 
F 0 "J1" H 7450 4350 60  0000 C CNN
677 677 
F 1 "HEADER_2x09_PARALLEL" H 7450 5400 60  0000 C CNN
678 678 
F 2 "Pin_Header_Rect_Pads:Straight_2x09" H 7450 5250 60  0001 C CNN
679 679 
F 3 "" H 7450 5250 60  0000 C CNN
......
747 747 
Wire Notes Line
748 748 
	2150 1200 1100 1200
749 749 
$Comp
750 
L C C9
750 
L C C1
751 751 
U 1 1 54875CD9
752 752 
P 4250 2450
753 
F 0 "C9" H 4250 2550 40  0000 L CNN
753 
F 0 "C1" H 4250 2550 40  0000 L CNN
754 754 
F 1 "100nF" H 4256 2365 40  0000 L CNN
755 755 
F 2 "Capacitors_SMD:C_0805_HandSoldering" H 4288 2300 30  0001 C CNN
756 756 
F 3 "" H 4250 2450 60  0000 C CNN
......
827 827 
	4250 2650 4250 2700
828 828 
Wire Wire Line
829 829 
	4250 2250 4250 2200
830 
$Comp
831 
L R R2
832 
U 1 1 54B800DF
833 
P 7450 5500
834 
F 0 "R2" V 7530 5500 40  0000 C CNN
835 
F 1 "68" V 7457 5501 40  0000 C CNN
836 
F 2 "" V 7380 5500 30  0000 C CNN
837 
F 3 "" H 7450 5500 30  0000 C CNN
838 
	1    7450 5500
839 
	0    1    1    0
840 
$EndComp
841 
$Comp
842 
L LED D1
843 
U 1 1 54B80114
844 
P 7950 5500
845 
F 0 "D1" H 7950 5600 50  0000 C CNN
846 
F 1 "GREEN" H 7950 5400 50  0000 C CNN
847 
F 2 "" H 7950 5500 60  0000 C CNN
848 
F 3 "" H 7950 5500 60  0000 C CNN
849 
	1    7950 5500
850 
	1    0    0    -1
851 
$EndComp
852 
Wire Wire Line
853 
	7750 5500 7700 5500
854 
$Comp
855 
L GND #PWR016
856 
U 1 1 54B80496
857 
P 8200 5550
858 
F 0 "#PWR016" H 8200 5300 60  0001 C CNN
859 
F 1 "GND" H 8200 5400 60  0001 C CNN
860 
F 2 "" H 8200 5550 60  0000 C CNN
861 
F 3 "" H 8200 5550 60  0000 C CNN
862 
	1    8200 5550
863 
	1    0    0    -1
864 
$EndComp
865 
Wire Wire Line
866 
	8200 5550 8200 5500
867 
Wire Wire Line
868 
	8200 5500 8150 5500
869 
Text Label 6850 5500 0    60   ~ 0
870 
ACTIVE
871 
Wire Wire Line
872 
	6850 5500 7200 5500
830 873 
$EndSCHEMATC
Modules/CommRF/BLE01A/SCH_PCB/BLE01A.cmp
1 
Cmp-Mod V01 Created by Cvpcb (2015-01-01 BZR 5345)-product   date = Út 6. leden 2015, 12:45:00 CET
1 
Cmp-Mod V01 Created by Cvpcb (2015-01-01 BZR 5345)-product   date = Po 19. leden 2015, 20:27:56 CET
2 2 

  		




  3
  3
  
    
BeginCmp


  		




  4
  
  
    
TimeStamp = /5463C409;


  		




  
  4
  
    
TimeStamp = /54875CD9;


  		




  5
  5
  
    
Reference = C1;


  		




  6
  6
  
    
ValeurCmp = 100nF;


  		




  7
  7
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  8
  8
  
    
EndCmp


  		




  9
  9
  
    

  		




  10
  10
  
    
BeginCmp


  		




  11
  
  
    
TimeStamp = /5463A888;


  		




  
  11
  
    
TimeStamp = /5463CB28;


  		




  12
  12
  
    
Reference = C2;


  		




  13
  
  
    
ValeurCmp = 22uF/6.3V;


  		




  14
  
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  15
  
  
    
EndCmp


  		




  16
  
  
    

  		




  17
  
  
    
BeginCmp


  		




  18
  
  
    
TimeStamp = /5463CB28;


  		




  19
  
  
    
Reference = C3;


  		




  20
  13
  
    
ValeurCmp = 1nF;


  		




  21
  14
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  22
  15
  
    
EndCmp


  		




  23
  16
  
    

  		




  24
  17
  
    
BeginCmp


  		




  25
  18
  
    
TimeStamp = /5463CD08;


  		




  26
  
  
    
Reference = C4;


  		




  
  19
  
    
Reference = C3;


  		




  27
  20
  
    
ValeurCmp = 1uF;


  		




  28
  21
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  29
  22
  
    
EndCmp


  		




  30
  23
  
    

  		




  31
  24
  
    
BeginCmp


  		




  32
  25
  
    
TimeStamp = /5463CB53;


  		




  33
  
  
    
Reference = C5;


  		




  
  26
  
    
Reference = C4;


  		




  34
  27
  
    
ValeurCmp = 12pF;


  		




  35
  28
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  36
  29
  
    
EndCmp


  		




  37
  30
  
    

  		




  38
  31
  
    
BeginCmp


  		




  39
  32
  
    
TimeStamp = /5463CABB;


  		




  40
  
  
    
Reference = C6;


  		




  
  33
  
    
Reference = C5;


  		




  41
  34
  
    
ValeurCmp = 12pF;


  		




  42
  35
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  43
  36
  
    
EndCmp


  		




  44
  37
  
    

  		




  45
  38
  
    
BeginCmp


  		




  46
  39
  
    
TimeStamp = /5463E21E;


  		




  47
  
  
    
Reference = C7;


  		




  
  40
  
    
Reference = C6;


  		




  48
  41
  
    
ValeurCmp = 100nF;


  		




  49
  42
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  50
  43
  
    
EndCmp


  		




  51
  44
  
    

  		




  52
  45
  
    
BeginCmp


  		




  53
  46
  
    
TimeStamp = /5463DF60;


  		




  54
  
  
    
Reference = C8;


  		




  
  47
  
    
Reference = C7;


  		




  55
  48
  
    
ValeurCmp = 33nF;


  		




  56
  49
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  57
  50
  
    
EndCmp


  		




  58
  51
  
    

  		




  59
  52
  
    
BeginCmp


  		




  60
  
  
    
TimeStamp = /54875CD9;


  		




  
  53
  
    
TimeStamp = /5463D5AF;


  		




  
  54
  
    
Reference = C8;


  		




  
  55
  
    
ValeurCmp = 1.8pF;


  		




  
  56
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  
  57
  
    
EndCmp


  		




  
  58
  
    

  		




  
  59
  
    
BeginCmp


  		




  
  60
  
    
TimeStamp = /5463E415;


  		




  61
  61
  
    
Reference = C9;


  		




  62
  
  
    
ValeurCmp = 100nF;


  		




  
  62
  
    
ValeurCmp = 1.2pF;


  		




  63
  63
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  64
  64
  
    
EndCmp


  		




  65
  65
  
    

  		




  66
  66
  
    
BeginCmp


  		




  67
  
  
    
TimeStamp = /5463D5AF;


  		




  
  67
  
    
TimeStamp = /5463D807;


  		




  68
  68
  
    
Reference = C10;


  		




  69
  
  
    
ValeurCmp = 1.8pF;


  		




  
  69
  
    
ValeurCmp = 2.2nF;


  		




  70
  70
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  71
  71
  
    
EndCmp


  		




  72
  72
  
    

  		




  73
  73
  
    
BeginCmp


  		




  74
  
  
    
TimeStamp = /5463E415;


  		




  
  74
  
    
TimeStamp = /5463C409;


  		




  75
  75
  
    
Reference = C11;


  		




  76
  
  
    
ValeurCmp = 1.2pF;


  		




  
  76
  
    
ValeurCmp = 100nF;


  		




  77
  77
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  78
  78
  
    
EndCmp


  		




  79
  79
  
    

  		




  80
  80
  
    
BeginCmp


  		




  81
  
  
    
TimeStamp = /5463D807;


  		




  
  81
  
    
TimeStamp = /5463A888;


  		




  82
  82
  
    
Reference = C12;


  		




  83
  
  
    
ValeurCmp = 2.2nF;


  		




  
  83
  
    
ValeurCmp = 22uF/6.3V;


  		




  84
  84
  
    
IdModule  = Capacitors_SMD:C_0805_HandSoldering;


  		




  85
  85
  
    
EndCmp


  		




  86
  86
  
    

  		




  87
  87
  
    
BeginCmp


  		




  
  88
  
    
TimeStamp = /54B80114;


  		




  
  89
  
    
Reference = D1;


  		




  
  90
  
    
ValeurCmp = GREEN;


  		




  
  91
  
    
IdModule  = LEDs:LED-0805;


  		




  
  92
  
    
EndCmp


  		




  
  93
  
    

  		




  
  94
  
    
BeginCmp


  		




  88
  95
  
    
TimeStamp = /5463A8AD;


  		




  89
  
  
    
Reference = D1;


  		




  
  96
  
    
Reference = D2;


  		




  90
  97
  
    
ValeurCmp = 1N4007;


  		




  91
  98
  
    
IdModule  = SMD_Packages:SMD-0805;


  		




  92
  99
  
    
EndCmp


  		




  93
  100
  
    

  		




  94
  101
  
    
BeginCmp


  		




  95
  
  
    
TimeStamp = /5463A76E;


  		




  
  102
  
    
TimeStamp = /547FBDAB;


  		




  96
  103
  
    
Reference = J1;


  		




  97
  
  
    
ValeurCmp = 1.9V ... 3.6V;


  		




  98
  
  
    
IdModule  = Pin_Headers_Rect_Pads:Straight_2x03;


  		




  
  104
  
    
ValeurCmp = HEADER_2x09_PARALLEL;


  		




  
  105
  
    
IdModule  = Mlab_Pin_Headers:Straight_2x09;


  		




  99
  106
  
    
EndCmp


  		




  100
  107
  
    

  		




  101
  108
  
    
BeginCmp


  		




  102
  
  
    
TimeStamp = /547FBDAB;


  		




  
  109
  
    
TimeStamp = /5463A76E;


  		




  103
  110
  
    
Reference = J2;


  		




  104
  
  
    
ValeurCmp = HEADER_2x09_PARALLEL;


  		




  105
  
  
    
IdModule  = Pin_Headers_Rect_Pads:Straight_2x09;


  		




  
  111
  
    
ValeurCmp = 1.9V ... 3.6V;


  		




  
  112
  
    
IdModule  = Mlab_Pin_Headers:Straight_2x03;


  		




  106
  113
  
    
EndCmp


  		




  107
  114
  
    

  		




  108
  115
  
    
BeginCmp


  		




  ......




  144
  151
  
    
TimeStamp = /54874DD9;


  		




  145
  152
  
    
Reference = M1;


  		




  146
  153
  
    
ValeurCmp = HOLE;


  		




  147
  
  
    
IdModule  = Wire_Pads:SolderWirePad_single_2-5mmDrill;


  		




  
  154
  
    
IdModule  = Mlab_Mechanical:MountingHole_3mm;


  		




  148
  155
  
    
EndCmp


  		




  149
  156
  
    

  		




  150
  157
  
    
BeginCmp


  		




  151
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TimeStamp = /54874ED0;


  		




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ValeurCmp = HOLE;


  		




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IdModule  = Wire_Pads:SolderWirePad_single_2-5mmDrill;


  		




  
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IdModule  = Mlab_Mechanical:MountingHole_3mm;


  		




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TimeStamp = /54874F05;


  		




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      Modules/CommRF/BLE01A/SCH_PCB/BLE01A.kicad_pcb
    
  





  1
  
  
    
(kicad_pcb (version 4) (host pcbnew "(2015-01-01 BZR 5345)-product")


  		




  
  1
  
    
(kicad_pcb (version 4) (host pcbnew "(2015-01-20 BZR 5382)-product")


  		




  2
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  (general


  		




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    (area 111.896914 93.577001 173.626353 139.3955)


  		




  
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    (area 106.666215 95.6945 175.3472 140.903101)


  		




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    (thickness 1.6)


  		




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    (drawings 17)


  		




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    (tracks 254)


  		




  
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    (tracks 246)


  		




  10
  10
  
    
    (zones 0)


  		




  11
  
  
    
    (modules 28)


  		




  12
  
  
    
    (nets 25)


  		




  
  11
  
    
    (modules 30)


  		




  
  12
  
    
    (nets 26)


  		




  13
  13
  
    
  )


  		




  14
  14
  
    

  		




  15
  15
  
    
  (page A4)


  		




  16
  16
  
    
  (title_block


  		




  17
  17
  
    
    (title BLE01)


  		




  18
  
  
    
    (date "3. 1. 2015")


  		




  
  18
  
    
    (date "20. 1. 2015")


  		




  19
  19
  
    
    (rev A)


  		




  20
  20
  
    
    (company "Mlab www.mlab.cz")


  		




  21
  21
  
    
    (comment 1 "Module with the NRF8001 Bluetooth Low Energy chip from Nordic Semiconductor")


  		




  ......




  46
  46
  
    
  )


  		




  47
  47
  
    

  		




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    (zone_45_only no)


  		




  56
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    (trace_min 0.254)


  		




  ......




  125
  125
  
    
  (net 20 "Net-(C7-Pad1)")


  		




  126
  126
  
    
  (net 21 "Net-(L1-Pad1)")


  		




  127
  127
  
    
  (net 22 "Net-(L1-Pad2)")


  		




  128
  
  
    
  (net 23 "Net-(C10-Pad1)")


  		




  129
  
  
    
  (net 24 "Net-(C10-Pad2)")


  		




  
  128
  
    
  (net 23 "Net-(C6-Pad1)")


  		




  
  129
  
    
  (net 24 "Net-(C8-Pad2)")


  		




  
  130
  
    
  (net 25 "Net-(D1-Pad1)")


  		




  130
  131
  
    

  		




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  132
  
    
  (net_class Default "This is the default net class."


  		




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    (clearance 0.127)


  		




  
  133
  
    
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  134
  
    
    (trace_width 0.254)


  		




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  135
  
    
    (via_dia 1)


  		




  135
  136
  
    
    (via_drill 0.5)


  		




  ......




  151
  152
  
    
    (add_net /XC1)


  		




  152
  153
  
    
    (add_net /XC2)


  		




  153
  154
  
    
    (add_net GND)


  		




  154
  
  
    
    (add_net "Net-(C10-Pad1)")


  		




  155
  
  
    
    (add_net "Net-(C10-Pad2)")


  		




  
  155
  
    
    (add_net "Net-(C6-Pad1)")


  		




  156
  156
  
    
    (add_net "Net-(C7-Pad1)")


  		




  157
  157
  
    
    (add_net "Net-(C8-Pad1)")


  		




  
  158
  
    
    (add_net "Net-(C8-Pad2)")


  		




  
  159
  
    
    (add_net "Net-(D1-Pad1)")


  		




  158
  160
  
    
    (add_net "Net-(L1-Pad1)")


  		




  159
  161
  
    
    (add_net "Net-(L1-Pad2)")


  		




  160
  162
  
    
    (add_net "Net-(R1-Pad2)")


  		




  161
  163
  
    
    (add_net VCC)


  		




  162
  164
  
    
  )


  		




  163
  165
  
    

  		




  164
  
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer F.Cu) (tedit 54A7A65F) (tstamp 549FD133)


  		




  165
  
  
    
    (at 147.24126 111.94542)


  		




  
  166
  
    
  (module SMD_Packages:SMD-0805 placed (layer B.Cu) (tedit 549FCE36) (tstamp 54B2DAB8)


  		




  
  167
  
    
    (at 153.6192 109.2962)


  		




  
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    (model smd/chip_cms.wrl


  		




  
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      (scale (xyz 0.1 0.1 0.1))


  		




  
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  191
  
    
    )


  		




  
  192
  
    
  )


  		




  
  193
  
    

  		




  
  194
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer B.Cu) (tedit 54A7A65F) (tstamp 54BE47C6)


  		




  
  195
  
    
    (at 134.53872 117.57152 180)


  		




  166
  196
  
    
    (descr "Capacitor SMD 0805, hand soldering")


  		




  167
  197
  
    
    (tags "capacitor 0805")


  		




  168
  
  
    
    (path /5463E21E)


  		




  
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  182
  
  
    
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    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)


  		




  
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    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)


  		




  185
  215
  
    
      (net 1 GND))


  		




  186
  216
  
    
    (model Capacitors_SMD/C_0805N.wrl


  		




  187
  217
  
    
      (at (xyz 0 0 0))


  		




  ......




  190
  220
  
    
    )


  		




  191
  221
  
    
  )


  		




  192
  222
  
    

  		




  193
  
  
    
  (module SMD_Packages:QFN-32-1EP placed (layer F.Cu) (tedit 54A7B3EC) (tstamp 549FD084)


  		




  194
  
  
    
    (at 133.63575 110.66145 180)


  		




  
  223
  
    
  (module SMD_Packages:QFN-32-1EP placed (layer B.Cu) (tedit 54A7B3EC) (tstamp 549FD084)


  		




  
  224
  
    
    (at 146.01444 113.51514)


  		




  195
  225
  
    
    (descr QFN-32-1EP)


  		




  196
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    (path /5463A669)


  		




  197
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  198
  
  
    
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  213
  
  
    
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    (pad 8 smd rect (at -2.39776 -1.7526) (size 0.59944 0.24892) (layers B.Cu B.Paste B.Mask)


  		




  224
  254
  
    
      (net 1 GND))


  		




  225
  
  
    
    (pad 13 smd rect (at 0.24892 2.40284 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  255
  
    
    (pad 13 smd rect (at 0.24892 -2.40284) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  226
  256
  
    
      (net 10 /MOSI))


  		




  227
  
  
    
    (pad 14 smd rect (at 0.74676 2.40284 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  257
  
    
    (pad 14 smd rect (at 0.74676 -2.40284) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  228
  258
  
    
      (net 11 /MISO))


  		




  229
  
  
    
    (pad 15 smd rect (at 1.24714 2.40284 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask))


  		




  230
  
  
    
    (pad 16 smd rect (at 1.74752 2.40284 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  259
  
    
    (pad 15 smd rect (at 1.24714 -2.40284) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask))


  		




  
  260
  
    
    (pad 16 smd rect (at 1.74752 -2.40284) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  231
  261
  
    
      (net 12 /RDYN))


  		




  232
  
  
    
    (pad 33 smd rect (at 0 0 180) (size 3.29946 3.29946) (layers F.Cu F.Paste F.Mask)


  		




  
  262
  
    
    (pad 33 smd rect (at 0 0) (size 3.29946 3.29946) (layers B.Cu B.Paste B.Mask)


  		




  233
  263
  
    
      (net 1 GND))


  		




  234
  
  
    
    (pad 9 smd rect (at -1.75006 2.40284 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  264
  
    
    (pad 9 smd rect (at -1.75006 -2.40284) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  235
  265
  
    
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  236
  
  
    
    (pad 10 smd rect (at -1.24968 2.40284 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  266
  
    
    (pad 10 smd rect (at -1.24968 -2.40284) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  237
  267
  
    
      (net 14 /RXD))


  		




  238
  
  
    
    (pad 11 smd rect (at -0.7493 2.40284 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  268
  
    
    (pad 11 smd rect (at -0.7493 -2.40284) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  239
  269
  
    
      (net 8 /SCK))


  		




  240
  
  
    
    (pad 12 smd rect (at -0.25146 2.40284 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  270
  
    
    (pad 12 smd rect (at -0.25146 -2.40284) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  241
  271
  
    
      (net 9 /REQN))


  		




  242
  
  
    
    (pad 17 smd rect (at 2.39776 1.74752 180) (size 0.59944 0.24892) (layers F.Cu F.Paste F.Mask)


  		




  
  272
  
    
    (pad 17 smd rect (at 2.39776 -1.74752) (size 0.59944 0.24892) (layers B.Cu B.Paste B.Mask)


  		




  243
  273
  
    
      (net 1 GND))


  		




  244
  
  
    
    (pad 18 smd rect (at 2.4003 1.24714 180) (size 0.59944 0.24892) (layers F.Cu F.Paste F.Mask)


  		




  
  274
  
    
    (pad 18 smd rect (at 2.4003 -1.24714) (size 0.59944 0.24892) (layers B.Cu B.Paste B.Mask)


  		




  245
  275
  
    
      (net 1 GND))


  		




  246
  
  
    
    (pad 19 smd rect (at 2.4003 0.7493 180) (size 0.59944 0.24892) (layers F.Cu F.Paste F.Mask)


  		




  
  276
  
    
    (pad 19 smd rect (at 2.4003 -0.7493) (size 0.59944 0.24892) (layers B.Cu B.Paste B.Mask)


  		




  247
  277
  
    
      (net 15 /RESET))


  		




  248
  
  
    
    (pad 20 smd rect (at 2.4003 0.24892 180) (size 0.59944 0.24892) (layers F.Cu F.Paste F.Mask)


  		




  
  278
  
    
    (pad 20 smd rect (at 2.4003 -0.24892) (size 0.59944 0.24892) (layers B.Cu B.Paste B.Mask)


  		




  249
  279
  
    
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  250
  
  
    
    (pad 21 smd rect (at 2.4003 -0.25146 180) (size 0.59944 0.24892) (layers F.Cu F.Paste F.Mask)


  		




  
  280
  
    
    (pad 21 smd rect (at 2.4003 0.25146) (size 0.59944 0.24892) (layers B.Cu B.Paste B.Mask)


  		




  251
  281
  
    
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  252
  
  
    
    (pad 22 smd rect (at 2.4003 -0.75184 180) (size 0.59944 0.24892) (layers F.Cu F.Paste F.Mask)


  		




  
  282
  
    
    (pad 22 smd rect (at 2.4003 0.75184) (size 0.59944 0.24892) (layers B.Cu B.Paste B.Mask)


  		




  253
  283
  
    
      (net 16 /ANT2))


  		




  254
  
  
    
    (pad 23 smd rect (at 2.4003 -1.25222 180) (size 0.59944 0.24892) (layers F.Cu F.Paste F.Mask)


  		




  
  284
  
    
    (pad 23 smd rect (at 2.4003 1.25222) (size 0.59944 0.24892) (layers B.Cu B.Paste B.Mask)


  		




  255
  285
  
    
      (net 1 GND))


  		




  256
  
  
    
    (pad 24 smd rect (at 2.4003 -1.7526 180) (size 0.59944 0.24892) (layers F.Cu F.Paste F.Mask)


  		




  
  286
  
    
    (pad 24 smd rect (at 2.4003 1.7526) (size 0.59944 0.24892) (layers B.Cu B.Paste B.Mask)


  		




  257
  287
  
    
      (net 2 /AVDD))


  		




  258
  
  
    
    (pad 25 smd rect (at 1.75006 -2.4003 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  288
  
    
    (pad 25 smd rect (at 1.75006 2.4003) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  259
  289
  
    
      (net 18 "Net-(R1-Pad2)"))


  		




  260
  
  
    
    (pad 26 smd rect (at 1.24968 -2.4003 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  290
  
    
    (pad 26 smd rect (at 1.24968 2.4003) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  261
  291
  
    
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  262
  
  
    
    (pad 27 smd rect (at 0.7493 -2.4003 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  292
  
    
    (pad 27 smd rect (at 0.7493 2.4003) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  263
  293
  
    
      (net 5 /XC2))


  		




  264
  
  
    
    (pad 28 smd rect (at 0.25146 -2.4003 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  294
  
    
    (pad 28 smd rect (at 0.25146 2.4003) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  265
  295
  
    
      (net 6 /XC1))


  		




  266
  
  
    
    (pad 29 smd rect (at -0.24892 -2.4003 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  296
  
    
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  267
  297
  
    
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  268
  
  
    
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  298
  
    
    (pad 30 smd rect (at -0.7493 2.4003) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  269
  299
  
    
      (net 1 GND))


  		




  270
  
  
    
    (pad 31 smd rect (at -1.24968 -2.4003 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  300
  
    
    (pad 31 smd rect (at -1.24968 2.4003) (size 0.24892 0.59944) (layers B.Cu B.Paste B.Mask)


  		




  271
  301
  
    
      (net 1 GND))


  		




  272
  
  
    
    (pad 32 smd rect (at -1.75006 -2.4003 180) (size 0.24892 0.59944) (layers F.Cu F.Paste F.Mask)


  		




  
  302
  
    
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  273
  303
  
    
      (net 21 "Net-(L1-Pad1)"))


  		




  274
  304
  
    
  )


  		




  275
  305
  
    

  		




  276
  
  
    
  (module Connect:SMA6251A13G50 (layer B.Cu) (tedit 54A7D23C) (tstamp 54A93B44)


  		




  277
  
  
    
    (at 118.4402 118.0465 180)


  		




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    (fp_line (start -3.5 -3.5) (end -3.5 3.5) (layer B.SilkS) (width 0.15))


  		




  307
  
  
    
    (pad 1 thru_hole circle (at 0 0 180) (size 2.5 2.5) (drill 1.5) (layers *.Cu *.Mask)


  		




  308
  
  
    
      (net 24 "Net-(C10-Pad2)"))


  		




  309
  
  
    
    (pad 2 thru_hole circle (at 2.54 2.54 180) (size 2.7 2.7) (drill 1.7) (layers *.Cu *.Mask)


  		




  310
  
  
    
      (net 1 GND))


  		




  311
  
  
    
    (pad 2 thru_hole circle (at -2.54 2.54 180) (size 2.7 2.7) (drill 1.7) (layers *.Cu *.Mask)


  		




  312
  
  
    
      (net 1 GND))


  		




  313
  
  
    
    (pad 2 thru_hole circle (at -2.54 -2.54 180) (size 2.7 2.7) (drill 1.7) (layers *.Cu *.Mask)


  		




  314
  
  
    
      (net 1 GND))


  		




  315
  
  
    
    (pad 2 thru_hole circle (at 2.54 -2.54 180) (size 2.7 2.7) (drill 1.7) (layers *.Cu *.Mask)


  		




  316
  
  
    
      (net 1 GND))


  		




  317
  
  
    
  )


  		




  318
  
  
    

  		




  319
  
  
    
  (module Wire_Pads:SolderWirePad_single_2-5mmDrill locked (layer F.Cu) (tedit 549F3E58) (tstamp 549FD199)


  		




  320
  
  
    
    (at 118.4275 102.8065 180)


  		




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    )


  		




  328
  
  
    
    (pad 1 thru_hole circle (at 0 0 180) (size 6 6) (drill 3) (layers *.Cu *.Mask F.SilkS)


  		




  329
  
  
    
      (net 1 GND))


  		




  330
  
  
    
  )


  		




  331
  
  
    

  		




  332
  
  
    
  (module Wire_Pads:SolderWirePad_single_2-5mmDrill locked (layer F.Cu) (tedit 549F3E5C) (tstamp 549FD193)


  		




  333
  
  
    
    (at 159.0675 102.8065 180)


  		




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  340
  
  
    
    )


  		




  341
  
  
    
    (pad 1 thru_hole circle (at 0 0 180) (size 6 6) (drill 3) (layers *.Cu *.Mask F.SilkS)


  		




  342
  
  
    
      (net 1 GND))


  		




  343
  
  
    
  )


  		




  344
  
  
    

  		




  345
  
  
    
  (module Wire_Pads:SolderWirePad_single_2-5mmDrill locked (layer F.Cu) (tedit 549F3E55) (tstamp 549FD18D)


  		




  346
  
  
    
    (at 118.4402 133.2738 180)


  		




  347
  
  
    
    (path /54874ED0)


  		




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    )


  		




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    (pad 1 thru_hole circle (at 0 0 180) (size 6 6) (drill 3) (layers *.Cu *.Mask F.SilkS)


  		




  355
  
  
    
      (net 1 GND))


  		




  356
  
  
    
  )


  		




  357
  
  
    

  		




  358
  
  
    
  (module Wire_Pads:SolderWirePad_single_2-5mmDrill locked (layer F.Cu) (tedit 549F3E4D) (tstamp 549FD187)


  		




  359
  
  
    
    (at 159.0675 133.2865 180)


  		




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    (pad 1 thru_hole circle (at 0 0 180) (size 6 6) (drill 3) (layers *.Cu *.Mask F.SilkS)


  		




  368
  
  
    
      (net 1 GND))


  		




  369
  
  
    
  )


  		




  370
  
  
    

  		




  371
  
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer F.Cu) (tedit 54A92E01) (tstamp 549FD181)


  		




  372
  
  
    
    (at 141.3002 113.4364)


  		




  
  306
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer B.Cu) (tedit 54A92E01) (tstamp 54BE47D3)


  		




  
  307
  
    
    (at 139.98448 116.49456 180)


  		




  373
  308
  
    
    (descr "Capacitor SMD 0805, hand soldering")


  		




  374
  309
  
    
    (tags "capacitor 0805")


  		




  375
  
  
    
    (path /5463C409)


  		




  
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  400
  
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer F.Cu) (tedit 54A6FF75) (tstamp 549FD174)


  		




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  (module Capacitors_SMD:C_0805_HandSoldering placed (layer B.Cu) (tedit 54BEA8A3) (tstamp 54BE47ED)


  		




  
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  428
  
  
    

  		




  429
  
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer F.Cu) (tedit 54A92DCC) (tstamp 54A814D8)


  		




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  ......




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    )


  		




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  457
  363
  
    

  		




  458
  
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer F.Cu) (tedit 54A92DDC) (tstamp 54A814CB)


  		




  459
  
  
    
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  ......




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  390
  
    
    )


  		




  485
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  )


  		




  486
  392
  
    

  		




  487
  
  
    
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  488
  
  
    
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  393
  
    
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  ......




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  419
  
    
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  514
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  515
  421
  
    

  		




  516
  
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer F.Cu) (tedit 54A92DEF) (tstamp 549FD140)


  		




  517
  
  
    
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      (net 1 GND))


  		




  538
  444
  
    
    (model Capacitors_SMD/C_0805N.wrl


  		




  539
  445
  
    
      (at (xyz 0 0 0))


  		




  ......




  542
  448
  
    
    )


  		




  543
  449
  
    
  )


  		




  544
  450
  
    

  		




  545
  
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer F.Cu) (tedit 54A7A675) (tstamp 54A99DB8)


  		




  546
  
  
    
    (at 147.24126 109.45622)


  		




  
  451
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer B.Cu) (tedit 54BD6535) (tstamp 54A99DB8)


  		




  
  452
  
    
    (at 153.6192 116.9162)


  		




  547
  453
  
    
    (descr "Capacitor SMD 0805, hand soldering")


  		




  548
  454
  
    
    (tags "capacitor 0805")


  		




  549
  
  
    
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  463
  
    
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  464
  
    
    (fp_line (start -2.3 -1) (end 2.3 -1) (layer B.CrtYd) (width 0.05))


  		




  
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    (fp_line (start -2.3 1) (end -2.3 -1) (layer B.CrtYd) (width 0.05))


  		




  
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    (fp_line (start 2.3 1) (end 2.3 -1) (layer B.CrtYd) (width 0.05))


  		




  
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    (fp_line (start 0.5 0.85) (end -0.5 0.85) (layer B.SilkS) (width 0.15))


  		




  
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    (fp_line (start -0.5 -0.85) (end 0.5 -0.85) (layer B.SilkS) (width 0.15))


  		




  
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      (net 3 "Net-(C8-Pad1)"))


  		




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    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)


  		




  566
  
  
    
      (net 1 GND))


  		




  
  471
  
    
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)


  		




  
  472
  
    
      (net 24 "Net-(C8-Pad2)"))


  		




  567
  473
  
    
    (model Capacitors_SMD/C_0805N.wrl


  		




  568
  474
  
    
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      (scale (xyz 1 1 1))


  		




  ......




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  477
  
    
    )


  		




  572
  478
  
    
  )


  		




  573
  479
  
    

  		




  574
  
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer F.Cu) (tedit 549FCDFB) (tstamp 54A92BBB)


  		




  575
  
  
    
    (at 141.1605 106.8578)


  		




  
  480
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer B.Cu) (tedit 54BD6521) (tstamp 54B2E26A)


  		




  
  481
  
    
    (at 153.6192 119.4181 180)


  		




  576
  482
  
    
    (descr "Capacitor SMD 0805, hand soldering")


  		




  577
  483
  
    
    (tags "capacitor 0805")


  		




  578
  
  
    
    (path /54875CD9)


  		




  
  484
  
    
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  593
  
  
    
      (net 19 VCC))


  		




  594
  
  
    
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  492
  
    
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  498
  
    
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  499
  
    
      (net 24 "Net-(C8-Pad2)"))


  		




  
  500
  
    
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)


  		




  595
  501
  
    
      (net 1 GND))


  		




  596
  502
  
    
    (model Capacitors_SMD/C_0805N.wrl


  		




  597
  503
  
    
      (at (xyz 0 0 0))


  		




  ......




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  506
  
    
    )


  		




  601
  507
  
    
  )


  		




  602
  508
  
    

  		




  603
  
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer F.Cu) (tedit 54A6FC28) (tstamp 549FD10C)


  		




  604
  
  
    
    (at 125.93955 117.73535 180)


  		




  
  509
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer B.Cu) (tedit 54A6FC28) (tstamp 54B2DA9D)


  		




  
  510
  
    
    (at 153.6192 106.5149 180)


  		




  605
  511
  
    
    (descr "Capacitor SMD 0805, hand soldering")


  		




  606
  512
  
    
    (tags "capacitor 0805")


  		




  607
  
  
    
    (path /5463D5AF)


  		




  
  513
  
    
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  623
  
  
    
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      (net 24 "Net-(C10-Pad2)"))


  		




  
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  528
  
    
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  529
  
    
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)


  		




  
  530
  
    
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  625
  531
  
    
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  532
  
    
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  ......




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  535
  
    
    )


  		




  630
  536
  
    
  )


  		




  631
  537
  
    

  		




  632
  
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer F.Cu) (tedit 54A6FC35) (tstamp 549FD0FF)


  		




  633
  
  
    
    (at 125.93955 120.44045)


  		




  
  538
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer B.Cu) (tedit 54A6FC35) (tstamp 54B2DA90)


  		




  
  539
  
    
    (at 138.7729 111.0996 180)


  		




  634
  540
  
    
    (descr "Capacitor SMD 0805, hand soldering")


  		




  635
  541
  
    
    (tags "capacitor 0805")


  		




  636
  
  
    
    (path /5463E415)


  		




  
  542
  
    
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  543
  
    
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  651
  
  
    
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  652
  
  
    
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  559
  
    
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  654
  560
  
    
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  561
  
    
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  ......




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  564
  
    
    )


  		




  659
  565
  
    
  )


  		




  660
  566
  
    

  		




  661
  
  
    
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  662
  
  
    
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  567
  
    
  (module Capacitors_SMD:C_0805_HandSoldering placed (layer B.Cu) (tedit 54A7B3F5) (tstamp 54B2DAAA)


  		




  
  568
  
    
    (at 148.9202 101.6508 270)


  		




  663
  569
  
    
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  664
  570
  
    
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    (fp_line (start -2.3 -1) (end 2.3 -1) (layer B.CrtYd) (width 0.05))


  		




  
  581
  
    
    (fp_line (start -2.3 1) (end -2.3 -1) (layer B.CrtYd) (width 0.05))


  		




  
  582
  
    
    (fp_line (start 2.3 1) (end 2.3 -1) (layer B.CrtYd) (width 0.05))


  		




  
  583
  
    
    (fp_line (start 0.5 0.85) (end -0.5 0.85) (layer B.SilkS) (width 0.15))


  		




  
  584
  
    
    (fp_line (start -0.5 -0.85) (end 0.5 -0.85) (layer B.SilkS) (width 0.15))


  		




  
  585
  
    
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)


  		




  
  586
  
    
      (net 19 VCC))


  		




  
  587
  
    
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)


  		




  682
  588
  
    
      (net 1 GND))


  		




  683
  589
  
    
    (model Capacitors_SMD/C_0805N.wrl


  		




  684
  590
  
    
      (at (xyz 0 0 0))


  		




  ......




  687
  593
  
    
    )


  		




  688
  594
  
    
  )


  		




  689
  595
  
    

  		




  690
  
  
    
  (module SMD_Packages:SMD-0805 placed (layer F.Cu) (tedit 54A6FF7D) (tstamp 549FD0E5)


  		




  691
  
  
    
    (at 127.4826 133.2865 90)


  		




  692
  
  
    
    (path /5463A8AD)


  		




  693
  
  
    
    (attr smd)


  		




  694
  
  
    
    (fp_text reference D1 (at 0 -0.3175 90) (layer F.SilkS)


  		




  695
  
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)))


  		




  696
  
  
    
    )


  		




  697
  
  
    
    (fp_text value 1N4007 (at 0 0.381 90) (layer F.SilkS) hide


  		




  698
  
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)))


  		




  699
  
  
    
    )


  		




  700
  
  
    
    (fp_circle (center -1.651 0.762) (end -1.651 0.635) (layer F.SilkS) (width 0.15))


  		




  701
  
  
    
    (fp_line (start -0.508 0.762) (end -1.524 0.762) (layer F.SilkS) (width 0.15))


  		




  702
  
  
    
    (fp_line (start -1.524 0.762) (end -1.524 -0.762) (layer F.SilkS) (width 0.15))


  		




  703
  
  
    
    (fp_line (start -1.524 -0.762) (end -0.508 -0.762) (layer F.SilkS) (width 0.15))


  		




  704
  
  
    
    (fp_line (start 0.508 -0.762) (end 1.524 -0.762) (layer F.SilkS) (width 0.15))


  		




  705
  
  
    
    (fp_line (start 1.524 -0.762) (end 1.524 0.762) (layer F.SilkS) (width 0.15))


  		




  706
  
  
    
    (fp_line (start 1.524 0.762) (end 0.508 0.762) (layer F.SilkS) (width 0.15))


  		




  707
  
  
    
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers F.Cu F.Paste F.Mask)


  		




  708
  
  
    
      (net 1 GND))


  		




  709
  
  
    
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers F.Cu F.Paste F.Mask)


  		




  710
  
  
    
      (net 19 VCC))


  		




  711
  
  
    
    (model smd/chip_cms.wrl


  		




  712
  
  
    
      (at (xyz 0 0 0))


  		




  713
  
  
    
      (scale (xyz 0.1 0.1 0.1))


  		




  714
  
  
    
      (rotate (xyz 0 0 0))


  		




  715
  
  
    
    )


  		




  716
  
  
    
  )


  		




  717
  
  
    

  		




  718
  
  
    
  (module SMD_Packages:SMD-0805 placed (layer F.Cu) (tedit 549FCE2F) (tstamp 54A814BE)


  		




  719
  
  
    
    (at 148.971 118.1862 270)


  		




  
  596
  
    
  (module SMD_Packages:SMD-0805 placed (layer B.Cu) (tedit 549FCE2F) (tstamp 54BE47FB)


  		




  
  597
  
    
    (at 137.0838 122.0089 180)


  		




  720
  598
  
    
    (path /5463C834)


  		




  721
  599
  
    
    (attr smd)


  		




  722
  
  
    
    (fp_text reference L1 (at 0 -0.3175 270) (layer F.SilkS)


  		




  723
  
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)))


  		




  
  600
  
    
    (fp_text reference L1 (at 0 0.3175 180) (layer B.SilkS)


  		




  
  601
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))


  		




  724
  602
  
    
    )


  		




  725
  
  
    
    (fp_text value 10uH (at 0 0.381 270) (layer F.SilkS) hide


  		




  726
  
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)))


  		




  
  603
  
    
    (fp_text value 10uH (at 0 -0.381 180) (layer B.SilkS) hide


  		




  
  604
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))


  		




  727
  605
  
    
    )


  		




  728
  
  
    
    (fp_circle (center -1.651 0.762) (end -1.651 0.635) (layer F.SilkS) (width 0.15))


  		




  729
  
  
    
    (fp_line (start -0.508 0.762) (end -1.524 0.762) (layer F.SilkS) (width 0.15))


  		




  730
  
  
    
    (fp_line (start -1.524 0.762) (end -1.524 -0.762) (layer F.SilkS) (width 0.15))


  		




  731
  
  
    
    (fp_line (start -1.524 -0.762) (end -0.508 -0.762) (layer F.SilkS) (width 0.15))


  		




  732
  
  
    
    (fp_line (start 0.508 -0.762) (end 1.524 -0.762) (layer F.SilkS) (width 0.15))


  		




  733
  
  
    
    (fp_line (start 1.524 -0.762) (end 1.524 0.762) (layer F.SilkS) (width 0.15))


  		




  734
  
  
    
    (fp_line (start 1.524 0.762) (end 0.508 0.762) (layer F.SilkS) (width 0.15))


  		




  735
  
  
    
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers F.Cu F.Paste F.Mask)


  		




  
  606
  
    
    (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))


  		




  
  607
  
    
    (fp_line (start -0.508 -0.762) (end -1.524 -0.762) (layer B.SilkS) (width 0.15))


  		




  
  608
  
    
    (fp_line (start -1.524 -0.762) (end -1.524 0.762) (layer B.SilkS) (width 0.15))


  		




  
  609
  
    
    (fp_line (start -1.524 0.762) (end -0.508 0.762) (layer B.SilkS) (width 0.15))


  		




  
  610
  
    
    (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))


  		




  
  611
  
    
    (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))


  		




  
  612
  
    
    (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))


  		




  
  613
  
    
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)


  		




  736
  614
  
    
      (net 21 "Net-(L1-Pad1)"))


  		




  737
  
  
    
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers F.Cu F.Paste F.Mask)


  		




  
  615
  
    
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)


  		




  738
  616
  
    
      (net 22 "Net-(L1-Pad2)"))


  		




  739
  617
  
    
    (model smd/chip_cms.wrl


  		




  740
  618
  
    
      (at (xyz 0 0 0))


  		




  ......




  743
  621
  
    
    )


  		




  744
  622
  
    
  )


  		




  745
  623
  
    

  		




  746
  
  
    
  (module SMD_Packages:SMD-0805 placed (layer F.Cu) (tedit 54A704D4) (tstamp 54A814B0)


  		




  747
  
  
    
    (at 145.2753 118.1735 90)


  		




  
  624
  
    
  (module SMD_Packages:SMD-0805 placed (layer B.Cu) (tedit 54A704D4) (tstamp 54BE4809)


  		




  
  625
  
    
    (at 137.0838 124.0917)


  		




  748
  626
  
    
    (path /5463C9FA)


  		




  749
  627
  
    
    (attr smd)


  		




  750
  
  
    
    (fp_text reference L2 (at 0 0.4572 90) (layer F.SilkS)


  		




  751
  
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)))


  		




  
  628
  
    
    (fp_text reference L2 (at 0 -0.4572) (layer B.SilkS)


  		




  
  629
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))


  		




  752
  630
  
    
    )


  		




  753
  
  
    
    (fp_text value 15nH (at 0 0.381 90) (layer F.SilkS) hide


  		




  754
  
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)))


  		




  
  631
  
    
    (fp_text value 15nH (at 0 -0.381) (layer B.SilkS) hide


  		




  
  632
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))


  		




  755
  633
  
    
    )


  		




  756
  
  
    
    (fp_circle (center -1.651 0.762) (end -1.651 0.635) (layer F.SilkS) (width 0.15))


  		




  757
  
  
    
    (fp_line (start -0.508 0.762) (end -1.524 0.762) (layer F.SilkS) (width 0.15))


  		




  758
  
  
    
    (fp_line (start -1.524 0.762) (end -1.524 -0.762) (layer F.SilkS) (width 0.15))


  		




  759
  
  
    
    (fp_line (start -1.524 -0.762) (end -0.508 -0.762) (layer F.SilkS) (width 0.15))


  		




  760
  
  
    
    (fp_line (start 0.508 -0.762) (end 1.524 -0.762) (layer F.SilkS) (width 0.15))


  		




  761
  
  
    
    (fp_line (start 1.524 -0.762) (end 1.524 0.762) (layer F.SilkS) (width 0.15))


  		




  762
  
  
    
    (fp_line (start 1.524 0.762) (end 0.508 0.762) (layer F.SilkS) (width 0.15))


  		




  763
  
  
    
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers F.Cu F.Paste F.Mask)


  		




  
  634
  
    
    (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))


  		




  
  635
  
    
    (fp_line (start -0.508 -0.762) (end -1.524 -0.762) (layer B.SilkS) (width 0.15))


  		




  
  636
  
    
    (fp_line (start -1.524 -0.762) (end -1.524 0.762) (layer B.SilkS) (width 0.15))


  		




  
  637
  
    
    (fp_line (start -1.524 0.762) (end -0.508 0.762) (layer B.SilkS) (width 0.15))


  		




  
  638
  
    
    (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))


  		




  
  639
  
    
    (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))


  		




  
  640
  
    
    (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))


  		




  
  641
  
    
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)


  		




  764
  642
  
    
      (net 22 "Net-(L1-Pad2)"))


  		




  765
  
  
    
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers F.Cu F.Paste F.Mask)


  		




  
  643
  
    
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)


  		




  766
  644
  
    
      (net 2 /AVDD))


  		




  767
  645
  
    
    (model smd/chip_cms.wrl


  		




  768
  646
  
    
      (at (xyz 0 0 0))


  		




  ......




  771
  649
  
    
    )


  		




  772
  650
  
    
  )


  		




  773
  651
  
    

  		




  774
  
  
    
  (module SMD_Packages:SMD-0805 placed (layer F.Cu) (tedit 549FCE24) (tstamp 549FD0BB)


  		




  775
  
  
    
    (at 125.93955 115.41125)


  		




  
  652
  
    
  (module SMD_Packages:SMD-0805 placed (layer B.Cu) (tedit 549FCE24) (tstamp 54B2DA83)


  		




  
  653
  
    
    (at 153.6192 114.554 180)


  		




  776
  654
  
    
    (path /5463D4F2)


  		




  777
  655
  
    
    (attr smd)


  		




  778
  
  
    
    (fp_text reference L3 (at 0 -0.3175) (layer F.SilkS)


  		




  779
  
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)))


  		




  
  656
  
    
    (fp_text reference L3 (at 0 0.3175 180) (layer B.SilkS)


  		




  
  657
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))


  		




  780
  658
  
    
    )


  		




  781
  
  
    
    (fp_text value 3.9nH (at 0 0.381) (layer F.SilkS) hide


  		




  782
  
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)))


  		




  
  659
  
    
    (fp_text value 3.9nH (at 0 -0.381 180) (layer B.SilkS) hide


  		




  
  660
  
    
      (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))


  		




  783
  661
  
    
    )


  		




  784
  
  
    
    (fp_circle (center -1.651 0.762) (end -1.651 0.635) (layer F.SilkS) (width 0.15))


  		




  785
  
  
    
    (fp_line (start -0.508 0.762) (end -1.524 0.762) (layer F.SilkS) (width 0.15))


  		




  786
  
  
    
    (fp_line (start -1.524 0.762) (end -1.524 -0.762) (layer F.SilkS) (width 0.15))


  		




  787
  
  
    
    (fp_line (start -1.524 -0.762) (end -0.508 -0.762) (layer F.SilkS) (width 0.15))


  		




  788
  
  
    
    (fp_line (start 0.508 -0.762) (end 1.524 -0.762) (layer F.SilkS) (width 0.15))


  		




  789
  
  
    
    (fp_line (start 1.524 -0.762) (end 1.524 0.762) (layer F.SilkS) (width 0.15))


  		




  790
  
  
    
    (fp_line (start 1.524 0.762) (end 0.508 0.762) (layer F.SilkS) (width 0.15))


  		




  791
  
  
    
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers F.Cu F.Paste F.Mask)


  		




  
  662
  
    
    (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))


  		




  
  663
  
    
    (fp_line (start -0.508 -0.762) (end -1.524 -0.762) (layer B.SilkS) (width 0.15))


  		




  
  664
  
    
    (fp_line (start -1.524 -0.762) (end -1.524 0.762) (layer B.SilkS) (width 0.15))


  		




  
  665
  
    
    (fp_line (start -1.524 0.762) (end -0.508 0.762) (layer B.SilkS) (width 0.15))


  		




  
  666
  
    
    (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))


  		




  
  667
  
    
    (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))


  		




  
  668
  
    
    (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))


  		




  
  669
  
    
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)


  		








... Этот diff ограничен, так как превышает максимальный отображаемый размер.

:@created_atf1425251101.1039553:@expires_in0