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Modules/CommRF/BLE01A/TODO.txt
1 
Plosny spoj ma spatne vrstvy.  RF soucastky musi byt zespodu modulu, tak aby byly stinene proti kovove desce.
2 
Podrobně je tento požadavek rozepsán v odstavci http://wiki.mlab.cz/doku.php?id=cs:rules&#layout_navrh_plosneho_spoje
3 

  		




  
  4
  
    
Krystal ma cesty vedene v nestinene vrstvě. U těchto vysokofrekvenčních spojů je nutné se vyhnout prokovům a raději vytvořit prokov v napájecí cestě, která kříží vedení od krystalu.


  		




  
  5
  
    

  		




  
  6
  
    
Vodiče RXD a TXD opět zbytečně obsahují prokovy a vedení ve stínící vrstvě. Pro odstranění prokovů by stačilo prohodit jejich pozici na výstupním konektoru. 


  		




  
  7
  
    

  		




  
  8
  
    
Svod od SMA konektoru pravděpodobně nerespektuje požadavky uvedené v datasheetu obvodu na impedanci cesty k anténě. Cesta by měla být určitě alespoň tlustčí.


  		




  
  9
  
    

  		




  
  10
  
    

  		




  
  11
  
    
Vývody SMA konektoru a díry pro šrouby by měly být připojené ke GND v obou vrtvách.  Modul by měl obsahovat prokovy vzájemně spojující zemní vrstvy. 


  		










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