       (general
         (links 409)
         (no_connects 409)
         (area 84.277999 50.241999 212.013001 140.766001)
         (no_connects 364)
         (area -16.306001 -94.538001 111.429001 -0.203999)
         (thickness 1.6)
         (drawings 7)
         (tracks 34)
         (tracks 514)
         (zones 0)
         (modules 165)
         (nets 99)
         (nets 98)
+      )
       (page A4)
-...
+      )
       (setup
         (last_trace_width 0.4)
         (last_trace_width 0.7)
         (user_trace_width 0.2)
         (user_trace_width 0.3)
         (user_trace_width 0.4)
-...
         (mod_edge_width 0.15)
         (mod_text_size 1 1)
         (mod_text_width 0.15)
         (pad_size 1.5 1.5)
         (pad_drill 0.6)
         (pad_size 2.70002 2.70002)
         (pad_drill 2.30124)
         (pad_to_mask_clearance 0)
         (aux_axis_origin 0 0)
         (visible_elements 7FFFFFFF)
-...
       (net 95 "/DOWNSTREAM PORT POWER SWITCHES/PWRON3_BATEN3")
       (net 96 "/DOWNSTREAM PORT POWER SWITCHES/PWRON2_BATEN2")
       (net 97 "/DOWNSTREAM PORT POWER SWITCHES/PWRON1_BATEN1")
       (net 98 "Net-(C50-Pad1)")
       (net_class Default "Toto je vÃ½chozÃ tÅ™Ãda sÃtÄ›."
         (clearance 0.2)
-...
         (add_net "Net-(C34-Pad1)")
         (add_net "Net-(C35-Pad1)")
         (add_net "Net-(C38-Pad1)")
         (add_net "Net-(C50-Pad1)")
         (add_net "Net-(C57-Pad1)")
         (add_net "Net-(C58-Pad1)")
         (add_net "Net-(C59-Pad2)")
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 5565993D)
         (at 72.39 -59.436)
         (at 91.186 -54.356)
         (path /555DEC99)
         (attr smd)
         (fp_text reference C15 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 556599D9)
         (at 94.742 -10.922)
         (at 6.096 -10.668)
         (path /5555526D/55556FAC)
         (attr smd)
         (fp_text reference C41 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 556599DF)
         (at -13.97 -103.378)
         (at 5.588 -39.624)
         (path /5555526D/555D7F82)
         (attr smd)
         (fp_text reference C42 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 556599E5)
         (at 100.076 -15.748)
         (at 8.636 -19.304)
         (path /5555526D/55556FAF)
         (attr smd)
         (fp_text reference C43 (at 0 0.3175) (layer B.SilkS)
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 556599EB)
         (at -10.922 -100.33)
         (at 7.112 -49.276)
         (path /5555526D/555D7F94)
         (attr smd)
         (fp_text reference C44 (at 0 0.3175) (layer B.SilkS)
-...
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
           (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
-...
+      )
       (module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 54BBE3ED) (tstamp 556599F1)
         (at 100.584 -19.05)
         (at 5.08 -25.908 90)
         (descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
         (tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
         (path /5555526D/55556FAD)
         (attr smd)
         (fp_text reference C45 (at -0.20066 3.29946) (layer B.SilkS)
         (fp_text reference C45 (at -0.20066 3.29946 90) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_text value 100uF (at -0.09906 -3.59918) (layer B.SilkS) hide
         (fp_text value 100uF (at -0.09906 -3.59918 90) (layer B.SilkS) hide
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start -5.00126 2.19964) (end -5.00126 -2.19964) (layer B.SilkS) (width 0.15))
         (fp_line (start -4.50088 -2.19964) (end 4.50088 -2.19964) (layer B.SilkS) (width 0.15))
         (fp_line (start 4.50088 2.19964) (end -4.50088 2.19964) (layer B.SilkS) (width 0.15))
         (fp_text user + (at -5.6515 2.79908) (layer B.SilkS)
         (fp_text user + (at -5.6515 2.79908 90) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start -5.65404 3.302) (end -5.65404 2.20218) (layer B.SilkS) (width 0.15))
         (fp_line (start -6.25348 2.80162) (end -5.0546 2.80162) (layer B.SilkS) (width 0.15))
         (pad 2 smd rect (at 3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 3.175 0 90) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 1 smd rect (at -3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
         (pad 1 smd rect (at -3.175 0 90) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
         (model MLAB_3D/Capacitors/c_tant_D.wrl
           (at (xyz 0 0 0))
           (scale (xyz 1 1 1))
-...
+      )
       (module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 54BBE3ED) (tstamp 556599F7)
         (at 13.208 -75.184 90)
         (at 6.096 -59.944 90)
         (descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
         (tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
         (path /5555526D/555D7F88)
-...
         (pad 2 smd rect (at 3.175 0 90) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 1 smd rect (at -3.175 0 90) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
           (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
         (model MLAB_3D/Capacitors/c_tant_D.wrl
           (at (xyz 0 0 0))
           (scale (xyz 1 1 1))
-...
+      )
       (module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 54BBE3C9) (tstamp 556599FD)
         (at 100.584 -23.876)
         (at 13.716 -13.208)
         (descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
         (tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
         (path /5555526D/55556FAE)
-...
         (pad 2 smd rect (at 2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 1 smd rect (at -2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
           (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
           (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
         (model MLAB_3D/Capacitors/c_tant_C.wrl
           (at (xyz 0 0 0))
           (scale (xyz 1 1 1))
-...
+      )
       (module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 54BBE3C9) (tstamp 55659A03)
         (at 5.08 -64.516)
         (at 12.192 -43.688)
         (descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
         (tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
         (path /5555526D/555D7F8E)
-...
         (pad 2 smd rect (at 2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 1 smd rect (at -2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
           (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
           (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
         (model MLAB_3D/Capacitors/c_tant_C.wrl
           (at (xyz 0 0 0))
           (scale (xyz 1 1 1))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A09)
         (at 102.108 -47.752)
         (at 45.72 -75.184 90)
         (path /5555526D/555D825C)
         (attr smd)
         (fp_text reference C49 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference C49 (at 0 0.3175 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 10 +5V))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A0F)
         (at -34.544 -60.452)
         (at 75.184 -70.612)
         (path /5555526D/555D82E6)
         (attr smd)
         (fp_text reference C50 (at 0 0.3175) (layer B.SilkS)
-...
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 98 "Net-(C50-Pad1)"))
           (net 10 +5V))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A15)
         (at 102.108 -37.338)
         (at 34.036 -77.724 90)
         (path /5555526D/555D826E)
         (attr smd)
         (fp_text reference C51 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference C51 (at 0 0.3175 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
         (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A1B)
         (at -37.084 -55.372)
         (at 62.484 -71.628 180)
         (path /5555526D/555D82F8)
         (attr smd)
         (fp_text reference C52 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference C52 (at 0 0.3175 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z"))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 53 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
         (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 54BBE3ED) (tstamp 55659A21)
         (at 102.616 -51.816)
         (at 24.892 -74.676 180)
         (descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
         (tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
         (path /5555526D/555D8262)
         (attr smd)
         (fp_text reference C53 (at -0.20066 3.29946) (layer B.SilkS)
         (fp_text reference C53 (at -0.20066 3.29946 180) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_text value 100uF (at -0.09906 -3.59918) (layer B.SilkS) hide
         (fp_text value 100uF (at -0.09906 -3.59918 180) (layer B.SilkS) hide
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start -5.00126 2.19964) (end -5.00126 -2.19964) (layer B.SilkS) (width 0.15))
         (fp_line (start -4.50088 -2.19964) (end 4.50088 -2.19964) (layer B.SilkS) (width 0.15))
         (fp_line (start 4.50088 2.19964) (end -4.50088 2.19964) (layer B.SilkS) (width 0.15))
         (fp_text user + (at -5.6515 2.79908) (layer B.SilkS)
         (fp_text user + (at -5.6515 2.79908 180) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start -5.65404 3.302) (end -5.65404 2.20218) (layer B.SilkS) (width 0.15))
         (fp_line (start -6.25348 2.80162) (end -5.0546 2.80162) (layer B.SilkS) (width 0.15))
         (pad 2 smd rect (at 3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 1 smd rect (at -3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
         (pad 1 smd rect (at -3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
         (model MLAB_3D/Capacitors/c_tant_D.wrl
           (at (xyz 0 0 0))
           (scale (xyz 1 1 1))
-...
+      )
       (module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 54BBE3ED) (tstamp 55659A27)
         (at -36.576 -68.326)
         (at 56.896 -75.184 180)
         (descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
         (tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
         (path /5555526D/555D82EC)
         (attr smd)
         (fp_text reference C54 (at -0.20066 3.29946) (layer B.SilkS)
         (fp_text reference C54 (at -0.20066 3.29946 180) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_text value 100uF (at -0.09906 -3.59918) (layer B.SilkS) hide
         (fp_text value 100uF (at -0.09906 -3.59918 180) (layer B.SilkS) hide
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start -5.00126 2.19964) (end -5.00126 -2.19964) (layer B.SilkS) (width 0.15))
         (fp_line (start -4.50088 -2.19964) (end 4.50088 -2.19964) (layer B.SilkS) (width 0.15))
         (fp_line (start 4.50088 2.19964) (end -4.50088 2.19964) (layer B.SilkS) (width 0.15))
         (fp_text user + (at -5.6515 2.79908) (layer B.SilkS)
         (fp_text user + (at -5.6515 2.79908 180) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start -5.65404 3.302) (end -5.65404 2.20218) (layer B.SilkS) (width 0.15))
         (fp_line (start -6.25348 2.80162) (end -5.0546 2.80162) (layer B.SilkS) (width 0.15))
         (pad 2 smd rect (at 3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 1 smd rect (at -3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z"))
         (pad 1 smd rect (at -3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
           (net 53 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
         (model MLAB_3D/Capacitors/c_tant_D.wrl
           (at (xyz 0 0 0))
           (scale (xyz 1 1 1))
-...
+      )
       (module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 54BBE3C9) (tstamp 55659A2D)
         (at 106.934 -36.83)
         (at 40.132 -76.708)
         (descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
         (tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
         (path /5555526D/555D8268)
-...
         (pad 2 smd rect (at 2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 1 smd rect (at -2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
           (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
           (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
         (model MLAB_3D/Capacitors/c_tant_C.wrl
           (at (xyz 0 0 0))
           (scale (xyz 1 1 1))
-...
+      )
       (module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 54BBE3C9) (tstamp 55659A33)
         (at -35.56 -53.34)
         (at 67.564 -77.216)
         (descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
         (tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
         (path /5555526D/555D82F2)
-...
         (pad 2 smd rect (at 2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 1 smd rect (at -2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
           (net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z"))
           (net 53 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
         (model MLAB_3D/Capacitors/c_tant_C.wrl
           (at (xyz 0 0 0))
           (scale (xyz 1 1 1))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A39)
         (at 16.256 -35.052 90)
         (at 11.684 -27.94 90)
         (path /5555B01B/555C68CB)
         (attr smd)
         (fp_text reference C57 (at 0 0.3175 90) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A6F)
         (at 50.8 -24.892)
         (at 46.736 -15.24)
         (path /5555B01B/555C520D)
         (attr smd)
         (fp_text reference C66 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A75)
         (at 12.954 -65.278 180)
         (at 11.176 -58.42 90)
         (path /5555B01B/555C8AC8)
         (attr smd)
         (fp_text reference C67 (at 0 0.3175 180) (layer B.SilkS)
         (fp_text reference C67 (at 0 0.3175 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS)
         (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 21 "Net-(C67-Pad1)"))
         (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A93)
         (at 66.04 -64.516)
         (at 54.356 -70.612 180)
         (path /5555B01B/555C8446)
         (attr smd)
         (fp_text reference C72 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference C72 (at 0 0.3175 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 23 "Net-(C72-Pad1)"))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A99)
         (at 54.356 -71.374 180)
         (at 49.276 -78.74 180)
         (path /5555B01B/555C8410)
         (attr smd)
         (fp_text reference C73 (at 0 0.3175 180) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A9F)
         (at 34.036 -72.136)
         (at 23.876 -70.104 180)
         (path /5555B01B/555C830B)
         (attr smd)
         (fp_text reference C74 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference C74 (at 0 0.3175 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 25 "Net-(C74-Pad1)"))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659AB7)
         (at 54.356 -69.088 180)
         (at 49.276 -76.2 180)
         (path /5555B01B/555C8416)
         (attr smd)
         (fp_text reference C78 (at 0 0.3175 180) (layer B.SilkS)
-...
+        )
+      )
       (module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 553517B5) (tstamp 55659ADE)
         (at 106.934 -14.732)
       (module Mlab_D:LED_1206 locked placed (layer B.Cu) (tedit 553517B5) (tstamp 55659ADE)
         (at 12.827 -36.97 180)
         (descr "Diode Mini-MELF Standard")
         (tags "Diode Mini-MELF Standard")
         (path /5555526D/55556FB0)
         (attr smd)
         (fp_text reference D2 (at 0 2.54) (layer B.SilkS)
         (fp_text reference D2 (at 0 2.54 180) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_text value LED (at 0 -3.81) (layer B.SilkS) hide
         (fp_text value LED (at 0 -3.81 180) (layer B.SilkS) hide
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start 2.21488 -1.50622) (end 2.53492 -1.81102) (layer B.Cu) (width 0.15))
         (fp_line (start 2.25298 -1.52146) (end 2.5273 -1.24968) (layer B.Cu) (width 0.15))
         (fp_line (start 2.2225 -1.24968) (end 2.21742 -1.81864) (layer B.Cu) (width 0.15))
         (fp_text user A (at -1.80086 -1.5494) (layer B.SilkS)
         (fp_text user A (at -1.80086 -1.5494 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
+        )
         (fp_text user K (at 1.80086 -1.5494) (layer B.SilkS)
         (fp_text user K (at 1.80086 -1.5494 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
+        )
         (pad 1 smd rect (at -2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 28 "Net-(D2-Pad1)"))
         (pad 2 smd rect (at 2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
         (pad "" thru_hole circle (at 0 0) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
         (pad 2 smd rect (at 2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
         (pad "" thru_hole circle (at 0 0 180) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
         (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
           (at (xyz 0 0 0))
           (scale (xyz 0.3937 0.3937 0.3937))
-...
+        )
+      )
       (module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AE5)
         (at -5.08 -97.536)
       (module Mlab_D:LED_1206 locked placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AE5)
         (at 12.827 -67.45 180)
         (descr "Diode Mini-MELF Standard")
         (tags "Diode Mini-MELF Standard")
         (path /5555526D/555D7F9A)
         (attr smd)
         (fp_text reference D3 (at 0 2.54) (layer B.SilkS)
         (fp_text reference D3 (at 0 2.54 180) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_text value LED (at 0 -3.81) (layer B.SilkS) hide
         (fp_text value LED (at 0 -3.81 180) (layer B.SilkS) hide
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start 2.21488 -1.50622) (end 2.53492 -1.81102) (layer B.Cu) (width 0.15))
         (fp_line (start 2.25298 -1.52146) (end 2.5273 -1.24968) (layer B.Cu) (width 0.15))
         (fp_line (start 2.2225 -1.24968) (end 2.21742 -1.81864) (layer B.Cu) (width 0.15))
         (fp_text user A (at -1.80086 -1.5494) (layer B.SilkS)
         (fp_text user A (at -1.80086 -1.5494 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
+        )
         (fp_text user K (at 1.80086 -1.5494) (layer B.SilkS)
         (fp_text user K (at 1.80086 -1.5494 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
+        )
         (pad 1 smd rect (at -2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 29 "Net-(D3-Pad1)"))
         (pad 2 smd rect (at 2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
         (pad "" thru_hole circle (at 0 0) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
         (pad 2 smd rect (at 2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
         (pad "" thru_hole circle (at 0 0 180) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
         (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
           (at (xyz 0 0 0))
           (scale (xyz 0.3937 0.3937 0.3937))
-...
+        )
+      )
       (module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AEC)
         (at 99.06 -40.894)
       (module Mlab_D:LED_1206 locked placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AEC)
         (at 36.97 -68.707 90)
         (descr "Diode Mini-MELF Standard")
         (tags "Diode Mini-MELF Standard")
         (path /5555526D/555D8274)
         (attr smd)
         (fp_text reference D4 (at 0 2.54) (layer B.SilkS)
         (fp_text reference D4 (at 0 2.54 90) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_text value LED (at 0 -3.81) (layer B.SilkS) hide
         (fp_text value LED (at 0 -3.81 90) (layer B.SilkS) hide
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start 2.21488 -1.50622) (end 2.53492 -1.81102) (layer B.Cu) (width 0.15))
         (fp_line (start 2.25298 -1.52146) (end 2.5273 -1.24968) (layer B.Cu) (width 0.15))
         (fp_line (start 2.2225 -1.24968) (end 2.21742 -1.81864) (layer B.Cu) (width 0.15))
         (fp_text user A (at -1.80086 -1.5494) (layer B.SilkS)
         (fp_text user A (at -1.80086 -1.5494 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
+        )
         (fp_text user K (at 1.80086 -1.5494) (layer B.SilkS)
         (fp_text user K (at 1.80086 -1.5494 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
+        )
         (pad 1 smd rect (at -2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 30 "Net-(D4-Pad1)"))
         (pad 2 smd rect (at 2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
         (pad "" thru_hole circle (at 0 0) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
         (pad 2 smd rect (at 2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
         (pad "" thru_hole circle (at 0 0 90) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
         (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
           (at (xyz 0 0 0))
           (scale (xyz 0.3937 0.3937 0.3937))
-...
+      )
       (module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AF3)
         (at -29.972 -56.134)
         (at 67.45 -68.707 90)
         (descr "Diode Mini-MELF Standard")
         (tags "Diode Mini-MELF Standard")
         (path /5555526D/555D82FE)
         (attr smd)
         (fp_text reference D5 (at 0 2.54) (layer B.SilkS)
         (fp_text reference D5 (at 0 2.54 90) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_text value LED (at 0 -3.81) (layer B.SilkS) hide
         (fp_text value LED (at 0 -3.81 90) (layer B.SilkS) hide
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start 2.21488 -1.50622) (end 2.53492 -1.81102) (layer B.Cu) (width 0.15))
         (fp_line (start 2.25298 -1.52146) (end 2.5273 -1.24968) (layer B.Cu) (width 0.15))
         (fp_line (start 2.2225 -1.24968) (end 2.21742 -1.81864) (layer B.Cu) (width 0.15))
         (fp_text user A (at -1.80086 -1.5494) (layer B.SilkS)
         (fp_text user A (at -1.80086 -1.5494 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
+        )
         (fp_text user K (at 1.80086 -1.5494) (layer B.SilkS)
         (fp_text user K (at 1.80086 -1.5494 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
+        )
         (pad 1 smd rect (at -2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 31 "Net-(D5-Pad1)"))
         (pad 2 smd rect (at 2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z"))
         (pad "" thru_hole circle (at 0 0) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
         (pad 2 smd rect (at 2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 53 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
         (pad "" thru_hole circle (at 0 0 90) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
         (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
           (at (xyz 0 0 0))
           (scale (xyz 0.3937 0.3937 0.3937))
-...
+      )
       (module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AFA)
         (at 47.752 -22.606 180)
         (at 29.62 -11.049 270)
         (descr "Diode Mini-MELF Standard")
         (tags "Diode Mini-MELF Standard")
         (path /5555B01B/555C574F)
         (attr smd)
         (fp_text reference D6 (at 0 2.54 180) (layer B.SilkS)
         (fp_text reference D6 (at 0 2.54 270) (layer B.SilkS)
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_text value GREEN (at 0 -3.81 180) (layer B.SilkS) hide
         (fp_text value GREEN (at 0 -3.81 270) (layer B.SilkS) hide
           (effects (font (thickness 0.3048)) (justify mirror))
+        )
         (fp_line (start 2.21488 -1.50622) (end 2.53492 -1.81102) (layer B.Cu) (width 0.15))
         (fp_line (start 2.25298 -1.52146) (end 2.5273 -1.24968) (layer B.Cu) (width 0.15))
         (fp_line (start 2.2225 -1.24968) (end 2.21742 -1.81864) (layer B.Cu) (width 0.15))
         (fp_text user A (at -1.80086 -1.5494 180) (layer B.SilkS)
         (fp_text user A (at -1.80086 -1.5494 270) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
+        )
         (fp_text user K (at 1.80086 -1.5494 180) (layer B.SilkS)
         (fp_text user K (at 1.80086 -1.5494 270) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
+        )
         (pad 1 smd rect (at -2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -2 0 270) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 32 "Net-(D6-Pad1)"))
         (pad 2 smd rect (at 2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 2 0 270) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
           (net 20 /USBPORT/USB_VBUS_UP))
         (pad "" thru_hole circle (at 0 0 180) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
         (pad "" thru_hole circle (at 0 0 270) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
         (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
           (at (xyz 0 0 0))
           (scale (xyz 0.3937 0.3937 0.3937))
-...
+      )
       (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B00)
         (at 37.592 -122.682)
         (at 34.036 -164.338)
         (descr "pin header straight 2x01")
         (tags "pin header straight 2x01")
         (path /555F8795)
-...
+      )
       (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B1E)
         (at 30.734 -99.441)
         (at 27.178 -141.097)
         (descr "pin header straight 2x01")
         (tags "pin header straight 2x01")
         (path /555F75CB)
-...
+      )
       (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B24)
         (at 30.861 -103.886)
         (at 27.305 -145.542)
         (descr "pin header straight 2x01")
         (tags "pin header straight 2x01")
         (path /555F7795)
-...
+      )
       (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B2A)
         (at 29.083 -109.093)
         (at 25.527 -150.749)
         (descr "pin header straight 2x01")
         (tags "pin header straight 2x01")
         (path /555F77EB)
-...
+      )
       (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B36)
         (at 28.448 -125.095)
         (at 24.892 -166.751)
         (descr "pin header straight 2x01")
         (tags "pin header straight 2x01")
         (path /555F789D)
-...
+      )
       (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B3C)
         (at 28.067 -118.11)
         (at 24.511 -159.766)
         (descr "pin header straight 2x01")
         (tags "pin header straight 2x01")
         (path /555F78F9)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B5C)
         (at 20.066 -32.766)
         (at 11.684 -23.876 270)
         (path /5555B01B/555C6655)
         (attr smd)
         (fp_text reference L3 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference L3 (at 0 0.3175 270) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value BLM21PG300SN1D (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 17 "Net-(C57-Pad1)"))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B62)
         (at 16.764 -64.516 90)
         (at 11.176 -53.848 270)
         (path /5555B01B/555C8AC2)
         (attr smd)
         (fp_text reference L4 (at 0 0.3175 90) (layer B.SilkS)
         (fp_text reference L4 (at 0 0.3175 270) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value BLM21PG300SN1D (at 0.127 -0.381 90) (layer B.SilkS)
         (fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 21 "Net-(C67-Pad1)"))
         (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B68)
         (at 63.246 -64.008 270)
         (at 58.42 -70.612)
         (path /5555B01B/555C8440)
         (attr smd)
         (fp_text reference L5 (at 0 0.3175 270) (layer B.SilkS)
         (fp_text reference L5 (at 0 0.3175) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS)
         (fp_text value BLM21PG300SN1D (at 0.127 -0.381) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 23 "Net-(C72-Pad1)"))
         (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 53 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B6E)
         (at 33.782 -75.184 270)
         (at 27.432 -70.104)
         (path /5555B01B/555C8305)
         (attr smd)
         (fp_text reference L6 (at 0 0.3175 270) (layer B.SilkS)
         (fp_text reference L6 (at 0 0.3175) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS)
         (fp_text value BLM21PG300SN1D (at 0.127 -0.381) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 25 "Net-(C74-Pad1)"))
         (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B88)
         (at 72.39 -64.262)
         (at 91.186 -59.182)
         (path /555DE85C)
         (attr smd)
         (fp_text reference R1 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B8E)
         (at 75.946 -64.262)
         (at 95.758 -59.182)
         (path /555DE91B)
         (attr smd)
         (fp_text reference R2 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B94)
         (at 72.39 -61.468)
         (at 91.186 -56.388)
         (path /555DE975)
         (attr smd)
         (fp_text reference R3 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B9A)
         (at 75.946 -61.468)
         (at 95.758 -56.388)
         (path /555DE953)
         (attr smd)
         (fp_text reference R4 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BA0)
         (at 77.724 -58.42)
         (at 97.536 -53.34)
         (path /555DEE17)
         (attr smd)
         (fp_text reference R5 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BA6)
         (at 76.2 -59.182)
         (at 96.012 -54.102)
         (path /555DEEA9)
         (attr smd)
         (fp_text reference R6 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BAC)
         (at 35.306 -99.314 180)
         (at 31.75 -140.97 180)
         (path /555F5F8B)
         (attr smd)
         (fp_text reference R7 (at 0 0.3175 180) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BB2)
         (at 23.368 -118.11 180)
         (at 19.812 -159.766 180)
         (path /555F6396)
         (attr smd)
         (fp_text reference R8 (at 0 0.3175 180) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BBE)
         (at 35.56 -103.886 180)
         (at 32.004 -145.542 180)
         (path /555F618E)
         (attr smd)
         (fp_text reference R10 (at 0 0.3175 180) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BC4)
         (at 24.638 -125.222 180)
         (at 21.082 -166.878 180)
         (path /555F640A)
         (attr smd)
         (fp_text reference R11 (at 0 0.3175 180) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BD6)
         (at 24.384 -108.966)
         (at 20.828 -150.622)
         (path /555F61E0)
         (attr smd)
         (fp_text reference R14 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BE2)
         (at 40.132 -34.798 270)
         (at 37.084 -31.496 270)
         (path /555F4735)
         (attr smd)
         (fp_text reference R16 (at 0 0.3175 270) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C24)
         (at 95.758 -13.716)
         (at 2.032 -15.24 90)
         (path /5555526D/55556FB3)
         (attr smd)
         (fp_text reference R27 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference R27 (at 0 0.3175 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 10K (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 10K (at 0.127 -0.381 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 5 +3V3))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C2A)
         (at -9.652 -103.124)
         (at 3.556 -49.276 270)
         (path /5555526D/555D7FAC)
         (attr smd)
         (fp_text reference R28 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference R28 (at 0 0.3175 270) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 10K (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 10K (at 0.127 -0.381 270) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 5 +3V3))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C30)
         (at 109.22 -23.368)
         (at 17.272 -39.624 90)
         (path /5555526D/55556FB1)
         (attr smd)
         (fp_text reference R29 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference R29 (at 0 0.3175 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 330R (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 330R (at 0.127 -0.381 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 28 "Net-(D2-Pad1)"))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C36)
         (at -6.096 -94.488)
         (at 14.732 -71.12 90)
         (path /5555526D/555D7FA0)
         (attr smd)
         (fp_text reference R30 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference R30 (at 0 0.3175 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 330R (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 330R (at 0.127 -0.381 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 29 "Net-(D3-Pad1)"))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C3C)
         (at 104.14 -40.386)
         (at 41.656 -67.056 180)
         (path /5555526D/555D8286)
         (attr smd)
         (fp_text reference R31 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference R31 (at 0 0.3175 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 10K (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 10K (at 0.127 -0.381 180) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 5 +3V3))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C42)
         (at -35.052 -58.166)
         (at 71.12 -69.596 90)
         (path /5555526D/555D8310)
         (attr smd)
         (fp_text reference R32 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference R32 (at 0 0.3175 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 10K (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 10K (at 0.127 -0.381 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 5 +3V3))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z"))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C48)
         (at 98.044 -38.1)
         (at 41.656 -64.516)
         (path /5555526D/555D827A)
         (attr smd)
         (fp_text reference R33 (at 0 0.3175) (layer B.SilkS)
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C4E)
         (at -28.448 -59.436)
         (at 67.564 -64.008 270)
         (path /5555526D/555D8304)
         (attr smd)
         (fp_text reference R34 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference R34 (at 0 0.3175 270) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 330R (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 330R (at 0.127 -0.381 270) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 31 "Net-(D5-Pad1)"))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C60)
         (at 50.8 -19.812)
         (at 29.464 -16.256 90)
         (path /5555B01B/555C43F5)
         (attr smd)
         (fp_text reference R37 (at 0 0.3175) (layer B.SilkS)
         (fp_text reference R37 (at 0 0.3175 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_text value 330R (at 0.127 -0.381) (layer B.SilkS)
         (fp_text value 330R (at 0.127 -0.381 90) (layer B.SilkS)
           (effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
+        )
         (fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
-...
         (fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
         (fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 32 "Net-(D6-Pad1)"))
         (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (model MLAB_3D/Resistors/chip_cms.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C6C)
         (at 54.356 -66.802 180)
         (at 49.276 -73.152 180)
         (path /5555B01B/555C840A)
         (attr smd)
         (fp_text reference R39 (at 0 0.3175 180) (layer B.SilkS)
-...
+      )
       (module Mlab_IO:TSSOP-8_4.4x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 54130A77) (tstamp 5566BC2A)
         (at 76.962 -67.818)
         (at 94.742 -63.246)
         (descr "8-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
         (tags "SSOP 0.65")
         (path /555DE7C3)
-...
+      )
       (module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 55659CC8) (tstamp 5566BC50)
         (at 101.092 -12.192)
         (at 5.588 -14.732 90)
         (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
         (tags "SSOP 0.65")
         (path /5555526D/55556FAA)
         (attr smd)
         (fp_text reference U5 (at 0 2.55) (layer B.SilkS)
         (fp_text reference U5 (at 0 2.55 90) (layer B.SilkS)
           (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
+        )
         (fp_text value TPS2001CDGN (at 0 -2.55) (layer B.Fab)
         (fp_text value TPS2001CDGN (at 0 -2.55 90) (layer B.Fab)
           (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
+        )
         (fp_line (start -2.8 1.8) (end -2.8 -1.8) (layer B.CrtYd) (width 0.05))
-...
         (fp_line (start -1.625 1.625) (end 1.625 1.625) (layer B.SilkS) (width 0.15))
         (fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer B.SilkS) (width 0.15))
         (fp_line (start -1.625 1.41) (end -2.55 1.41) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 2 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at -2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 10 +5V))
         (pad 3 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 3 smd rect (at -2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 10 +5V))
         (pad 4 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 4 smd rect (at -2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 97 "/DOWNSTREAM PORT POWER SWITCHES/PWRON1_BATEN1"))
         (pad 5 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 5 smd rect (at 2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
         (pad 6 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 6 smd rect (at 2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
         (pad 7 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 7 smd rect (at 2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
         (pad 8 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 8 smd rect (at 2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
         (pad 9 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at 0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at 0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (pad 9 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at -0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (pad 9 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at -0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 55659CC8) (tstamp 5566BC5F)
         (at 7.62 -68.072)
         (at 4.572 -44.196 90)
         (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
         (tags "SSOP 0.65")
         (path /5555526D/555D7FD9)
         (attr smd)
         (fp_text reference U6 (at 0 2.55) (layer B.SilkS)
         (fp_text reference U6 (at 0 2.55 90) (layer B.SilkS)
           (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
+        )
         (fp_text value TPS2001CDGN (at 0 -2.55) (layer B.Fab)
         (fp_text value TPS2001CDGN (at 0 -2.55 90) (layer B.Fab)
           (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
+        )
         (fp_line (start -2.8 1.8) (end -2.8 -1.8) (layer B.CrtYd) (width 0.05))
-...
         (fp_line (start -1.625 1.625) (end 1.625 1.625) (layer B.SilkS) (width 0.15))
         (fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer B.SilkS) (width 0.15))
         (fp_line (start -1.625 1.41) (end -2.55 1.41) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 2 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at -2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 10 +5V))
         (pad 3 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 3 smd rect (at -2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 10 +5V))
         (pad 4 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 4 smd rect (at -2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 96 "/DOWNSTREAM PORT POWER SWITCHES/PWRON2_BATEN2"))
         (pad 5 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 5 smd rect (at 2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
         (pad 6 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 6 smd rect (at 2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
         (pad 7 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 7 smd rect (at 2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
         (pad 8 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 8 smd rect (at 2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
         (pad 9 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at 0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at 0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (pad 9 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at -0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (pad 9 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at -0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 55659CC8) (tstamp 5566BC6E)
         (at 102.616 -43.942)
         (at 42.164 -71.12 180)
         (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
         (tags "SSOP 0.65")
         (path /5555526D/555D82B3)
         (attr smd)
         (fp_text reference U7 (at 0 2.55) (layer B.SilkS)
         (fp_text reference U7 (at 0 2.55 180) (layer B.SilkS)
           (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
+        )
         (fp_text value TPS2001CDGN (at 0 -2.55) (layer B.Fab)
         (fp_text value TPS2001CDGN (at 0 -2.55 180) (layer B.Fab)
           (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
+        )
         (fp_line (start -2.8 1.8) (end -2.8 -1.8) (layer B.CrtYd) (width 0.05))
-...
         (fp_line (start -1.625 1.625) (end 1.625 1.625) (layer B.SilkS) (width 0.15))
         (fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer B.SilkS) (width 0.15))
         (fp_line (start -1.625 1.41) (end -2.55 1.41) (layer B.SilkS) (width 0.15))
         (pad 1 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 1 smd rect (at -2.105 0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 2 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 2 smd rect (at -2.105 0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 10 +5V))
         (pad 3 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 3 smd rect (at -2.105 -0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 10 +5V))
         (pad 4 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 4 smd rect (at -2.105 -0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 95 "/DOWNSTREAM PORT POWER SWITCHES/PWRON3_BATEN3"))
         (pad 5 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 5 smd rect (at 2.105 -0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
         (pad 6 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 6 smd rect (at 2.105 -0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
         (pad 7 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 7 smd rect (at 2.105 0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
         (pad 8 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
         (pad 8 smd rect (at 2.105 0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
         (pad 9 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at 0.42 -0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at 0.42 0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (pad 9 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at -0.42 -0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (pad 9 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
         (pad 9 smd rect (at -0.42 0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
           (net 2 GND) (solder_paste_margin_ratio -0.2))
         (model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
           (at (xyz 0 0 0))
-...
+      )
       (module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 55659CC8) (tstamp 5566BC7D)
         (at -35.306 -64.516 180)
         (at 68.58 -73.66 180)
         (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
         (tags "SSOP 0.65")
         (path /5555526D/555D833D)
-...
         (pad 1 smd rect (at -2.105 0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 2 GND))
         (pad 2 smd rect (at -2.105 0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 98 "Net-(C50-Pad1)"))
           (net 10 +5V))
         (pad 3 smd rect (at -2.105 -0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
           (net 98 "Net-(C50-Pad1)"))